Construction and protection of components in negative pressure wound therapy systems

ABSTRACT

Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, a negative pressure source, a canister, an antenna, and one or more controllers. The negative pressure source can provide negative pressure via a fluid flow path to a wound dressing. The canister can be positioned in the fluid flow path and collect fluid removed from the wound dressing. The antenna can be supported by the housing and wirelessly communicate with an electronic device. The antenna can be oriented in the housing to face downward toward the ground when the negative pressure source is providing negative pressure. The one or more controllers can activate and deactivate the negative pressure source and transmit first data to the electronic device using the antenna or receive second data from the electronic device using the antenna.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a U.S. national stage application of InternationalPatent Application No. PCT/US2017/053557, filed Sep. 26, 2017, whichclaims the benefit of U.S. Provisional Application No. 62/401,728, filedSep. 29, 2016, and U.S. Provisional Application No. 62/468,258, filedMar. 7, 2017; the disclosures of which are hereby incorporated byreference in their entirety.

BACKGROUND

Embodiments of the present disclosure relate to methods and apparatusesfor dressing and treating a wound with negative or reduced pressuretherapy or topical negative pressure (TNP) therapy. In particular, butwithout limitation, embodiments disclosed herein relate to negativepressure therapy devices, methods for controlling the operation of TNPsystems, and methods of using TNP systems.

BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of the present disclosure will be apparent fromthe following detailed description, taken in conjunction with theaccompanying drawings of which:

FIG. 1 illustrates a reduced pressure wound therapy system according tosome embodiments.

FIGS. 2A, 2B, and 2C illustrate a pump assembly and canister accordingto some embodiments.

FIG. 3 illustrates an electrical component schematic of a pump assemblyaccording to some embodiments.

FIGS. 4A, 4B, 4C, 4D, 4E, and 4F illustrate a pump assembly according tosome embodiments.

FIGS. 5A, 5B, 50, 5D, and 5E illustrate a pump assembly according tosome embodiments.

FIGS. 6A and 6B illustrate a front and back of a main circuit boardassembly according to some embodiments.

FIGS. 7A, 7B, 70, and 7D illustrate a communications circuit boardassembly according to some embodiments.

FIGS. 8A and 8B illustrate a top layer and bottom film of acommunications circuit board assembly according to some embodiments.

FIGS. 8C and 8D illustrate an internal ground plane and an internalpower plane of the communications circuit board assembly of FIGS. 8A and8B according to some embodiments.

FIG. 9 illustrates a pump assembly communicating using an antennaaccording to some embodiments.

DETAILED DESCRIPTION

The present disclosure relates to methods and apparatuses for dressingand treating a wound with reduced pressure therapy or topical negativepressure (TNP) therapy. In particular, but without limitation,embodiments of this disclosure relate to negative pressure therapyapparatuses, methods for controlling the operation of TNP systems, andmethods of using TNP systems. The methods and apparatuses canincorporate or implement any combination of the features describedbelow.

Many different types of wound dressings are known for aiding in thehealing process of a human or animal. These different types of wounddressings include many different types of materials and layers, forexample, gauze, pads, foam pads or multi-layer wound dressings. TNPtherapy, sometimes referred to as vacuum assisted closure, negativepressure wound therapy, or reduced pressure wound therapy, can be abeneficial mechanism for improving the healing rate of a wound. Suchtherapy is applicable to a broad range of wounds such as incisionalwounds, open wounds and abdominal wounds or the like.

TNP therapy can assist in the closure and healing of wounds by reducingtissue oedema, encouraging blood flow, stimulating the formation ofgranulation tissue, removing excess exudates, and reducing bacterialload and thus, infection to the wound. Furthermore, TNP therapy canpermit less outside disturbance of the wound and promote more rapidhealing.

As is used herein, reduced or negative pressure levels, such as −X mmHg,represent pressure levels that are below atmospheric pressure, whichtypically corresponds to 760 mmHg (or 1 atm, 29.93 inHg, 101.325 kPa,14.696 psi, etc.). Accordingly, a negative pressure value of −X mmHgreflects pressure that is X mmHg below atmospheric pressure, such as apressure of (760−X) mmHg. In addition, negative pressure that is “less”or “smaller” than −X mmHg corresponds to pressure that is closer toatmospheric pressure (for example, −40 mmHg is less than −60 mmHg).Negative pressure that is “more” or “greater” than −X mmHg correspondsto pressure that is further from atmospheric pressure (for example, −80mmHg is more than −60 mmHg).

System Overview

A pump assembly can include one or more features that improve thetolerance of the pump assembly to environmental conditions, such as hightemperature, high altitude, electromagnetic radiation, or electrostaticdischarge (ESD). The improved tolerance of the pump assembly can, forexample, enable the pump assembly to function despite non-idealenvironmental conditions or function more safely in the presence ofcertain environmental conditions. The pump assembly can be small,compact, and light and capable of transmitting and receiving wirelesscommunications and able to meet stringent electrical immunity standards.Although one or more features are described separately, in someinstances, one or more of the features can be combined in particularimplementations of pump assemblies.

FIG. 1 illustrates an embodiment of a negative or reduced pressure woundtreatment (or TNP) system 100 comprising a wound filler 130 placedinside a wound cavity 110, the wound cavity sealed by a wound cover 120.The wound filler 130 in combination with the wound cover 120 can bereferred to as wound dressing. A single or multi lumen tube or conduit140 is connected the wound cover 120 with a pump assembly 150 configuredto supply reduced pressure. The wound cover 120 can be in fluidiccommunication with the wound cavity 110. In any of the systemembodiments disclosed herein, as in the embodiment illustrated in FIG.1, the pump assembly can be a canisterless pump assembly (meaning thatexudate is collected in the wound dressing or is transferred via tube140 for collection to another location). However, any of the pumpassembly embodiments disclosed herein can be configured to include orsupport a canister. Additionally, in any of the system embodimentsdisclosed herein, any of the pump assembly embodiments can be mounted toor supported by the dressing, or adjacent to the dressing.

The wound filler 130 can be any suitable type, such as hydrophilic orhydrophobic foam, gauze, inflatable bag, and so on. The wound filler 130can be conformable to the wound cavity 110 such that it substantiallyfills the cavity. The wound cover 120 can provide a substantially fluidimpermeable seal over the wound cavity 110. The wound cover 120 can havea top side and a bottom side, and the bottom side adhesively (or in anyother suitable manner) seals with wound cavity 110. The conduit 140 orlumen or any other conduit or lumen disclosed herein can be formed frompolyurethane, PVC, nylon, polyethylene, silicone, or any other suitablematerial.

Some embodiments of the wound cover 120 can have a port (not shown)configured to receive an end of the conduit 140. For example, the portcan be Renays Soft Port available from Smith & Nephew. In otherembodiments, the conduit 140 can otherwise pass through and/or under thewound cover 120 to supply reduced pressure to the wound cavity 110 so asto maintain a desired level of reduced pressure in the wound cavity. Theconduit 140 can be any suitable article configured to provide at least asubstantially sealed fluid flow pathway between the pump assembly 150and the wound cover 120, so as to supply the reduced pressure providedby the pump assembly 150 to wound cavity 110.

The wound cover 120 and the wound filler 130 can be provided as a singlearticle or an integrated single unit. In some embodiments, no woundfiller is provided and the wound cover by itself may be considered thewound dressing. The wound dressing may then be connected, via theconduit 140, to a source of negative pressure, such as the pump assembly150. The pump assembly 150 can be miniaturized and portable, althoughlarger conventional pumps such can also be used.

The wound cover 120 can be located over a wound site to be treated. Thewound cover 120 can form a substantially sealed cavity or enclosure overthe wound site. In some embodiments, the wound cover 120 can beconfigured to have a film having a high water vapor permeability toenable the evaporation of surplus fluid, and can have a superabsorbingmaterial contained therein to safely absorb wound exudate. It will beappreciated that throughout this specification reference is made to awound. In this sense it is to be understood that the term wound is to bebroadly construed and encompasses open and closed wounds in which skinis torn, cut or punctured or where trauma causes a contusion, or anyother surficial or other conditions or imperfections on the skin of apatient or otherwise that benefit from reduced pressure treatment, Awound is thus broadly defined as any damaged region of tissue wherefluid may or may not be produced. Examples of such wounds include, butare not limited to, acute wounds, chronic wounds, surgical incisions andother incisions, subacute and dehisced wounds, traumatic wounds, flapsand skin grafts, lacerations, abrasions, contusions, burns, diabeticulcers, pressure ulcers, stoma, surgical wounds, trauma and venousulcers or the like. The components of the TNP system described hereincan be particularly suited for incisional wounds that exude a smallamount of wound exudate.

Some embodiments of the system are designed to operate without the useof an exudate canister. Some embodiments can be configured to support anexudate canister. In some embodiments, configuring the pump assembly 150and tubing 140 so that the tubing 140 can be quickly and easily removedfrom the pump assembly 150 can facilitate or improve the process ofdressing or pump changes, if necessary. Any of the pump embodimentsdisclosed herein can be configured to have any suitable connectionbetween the tubing and the pump.

The pump assembly 150 can be configured to deliver negative pressure ofapproximately −80 mmHg, or between about −20 mmHg and 200 mmHg in someimplementations. Note that these pressures are relative to normalambient atmospheric pressure thus, −200 mmHg would be about 560 mmHg inpractical terms. The pressure range can be between about −40 mmHg and−150 mmHg. Alternatively a pressure range of up to −75 mmHg, up to −80mmHg or over −80 mmHg can be used. Also a pressure range of below −75mmHg can be used. Alternatively a pressure range of over approximately−100 mmHg, or even 150 mmHg, can be supplied by the pump assembly 150.

In operation, the wound filler 130 is inserted into the wound cavity 110and wound cover 120 is placed so as to seal the wound cavity 110. Thepump assembly 150 provides a source of a negative pressure to the woundcover 120, which is transmitted to the wound cavity 110 via the woundfiller 130. Fluid (e.g., wound exudate) is drawn through the conduit140, and can be stored in a canister. In some embodiments, fluid isabsorbed by the wound filler 130 or one or more absorbent layers (notshown).

Wound dressings that may be utilized with the pump assembly and otherembodiments of the present application include Renasys-F, Renasys-G,Renasys AB, and Pico Dressings available from Smith & Nephew. Furtherdescription of such wound dressings and other components of a negativepressure wound therapy system that may be used with the pump assemblyand other embodiments of the present application are found in U.S.Patent Publication Nos. 2011/0213287, 2011/0282309, 2012/0116334,2012/0136325, and 2013/0110058, which are incorporated by reference intheir entirety. In other embodiments, other suitable wound dressings canbe utilized.

FIG. 2A illustrates a front view of a pump assembly 230 and canister 220according to some embodiments. As is illustrated, the pump assembly 230and the canister are connected, thereby forming a negative pressurewound therapy device. The pump assembly 230 can be similar to or thesame as the pump assembly 150 in some embodiments.

The pump assembly 230 includes one or more indicators, such as visualindicator 202 configured to indicate alarms and visual indicator 204configured to indicate status of the TNP system. The indicators 202 and204 can be configured to alert a user, such as patient or medical careprovider, to a variety of operating and/or failure conditions of thesystem, including alerting the user to normal or proper operatingconditions, pump failure, power supplied to the pump or power failure,detection of a leak within the wound cover or flow pathway, suctionblockage, or any other similar or suitable conditions or combinationsthereof. The pump assembly 230 can comprise additional indicators. Thepump assembly can use a single indicator or multiple indicators. Anysuitable indicator can be used such as visual, audio, tactile indicator,and so on. The indicator 202 can be configured to signal alarmconditions, such as canister full, power low, conduit 140 disconnected,seal broken in the wound seal 120, and so on. The indicator 202 can beconfigured to display red flashing light to draw user's attention. Theindicator 204 can be configured to signal status of the TNP system, suchas therapy delivery is ok, leak detected, and so on. The indicator 204can be configured to display one or more different colors of light, suchas green, yellow, etc. For example, green light can be emitted when theTNP system is operating properly and yellow light can be emitted toindicate a warning.

The pump assembly 230 includes a display or screen 206 mounted in arecess 208 formed in a case of the pump assembly. The display 206 can bea touch screen display. The display 206 can support playback ofaudiovisual (AV) content, such as instructional videos. As explainedbelow, the display 206 can be configured to render a number of screensor graphical user interfaces (GUIs) for configuring, controlling, andmonitoring the operation of the TNP system. The pump assembly 230comprises a gripping portion 210 formed in the case of the pumpassembly. The gripping portion 210 can be configured to assist the userto hold the pump assembly 230, such as during removal of the canister220. The canister 220 can be replaced with another canister, such aswhen the canister 220 has been filled with fluid.

The pump assembly 230 includes one or more keys or buttons 212configured to allow the user to operate and monitor the operation of theTNP system. As is illustrated, there buttons 212 a, 212 b, and 212 c areincluded, Button 212 a can be configured as a power button to turnon/off the pump assembly 230. Button 212 b can be configured as aplay/pause button for the delivery of negative pressure therapy. Forexample, pressing the button 212 b can cause therapy to start, andpressing the button 212 b afterward can cause therapy to pause or end.Button 212 c can be configured to lock the display 206 and/or thebuttons 212. For instance, button 212 c can be pressed so that the userdoes not unintentionally alter the delivery of the therapy, Button 212 ccan be depressed to unlock the controls. In other embodiments,additional buttons can be used or one or more of the illustrated buttons212 a, 212 b, or 212 c can be omitted. Multiple key presses and/orsequences of key presses can be used to operate the pump assembly 230.

The pump assembly 230 includes one or more latch recesses 222 formed inthe cover. In the illustrated embodiment, two latch recesses 222 can beformed on the sides of the pump assembly 230. The latch recesses 222 canbe configured to allow attachment and detachment of the canister 220using one or more canister latches 221. The pump assembly 230 comprisesan air outlet 224 for allowing air removed from the wound cavity 110 toescape, Air entering the pump assembly can be passed through one or moresuitable filters, such as antibacterial filters. This can maintainreusability of the pump assembly. The pump assembly 230 includes one ormore strap mounts 226 for connecting a carry strap to the pump assembly230 or for attaching a cradle. In the illustrated embodiment, two strapmounts 226 can be formed on the sides of the pump assembly 230. In someembodiments, various of these features are omitted and/or variousadditional features are added to the pump assembly 230.

The canister 220 is configured to hold fluid (e.g., exudate) removedfrom the wound cavity 110. The canister 220 includes one or more latches221 for attaching the canister to the pump assembly 230. In theillustrated embodiment, the canister 220 comprises two latches 221 onthe sides of the canister. The exterior of the canister 220 can formedfrom frosted plastic so that the canister is substantially opaque andthe contents of the canister and substantially hidden from plain view.The canister 220 comprises a gripping portion 214 formed in a case ofthe canister. The gripping portion 214 can be configured to allow theuser to hold the pump assembly 220, such as during removal of thecanister from the apparatus 230. The canister 220 includes asubstantially transparent window 216, which can also include graduationsof volume. For example, the illustrated 300 mL canister 220 includesgraduations of 50 mL, 100 mL, 150 mL, 200 mL, 250 mL, and 300 mL. Otherembodiments of the canister can hold different volume of fluid and caninclude different graduation scale. For example, the canister can be an800 mL canister. The canister 220 comprises a tubing channel 218 forconnecting to the conduit 140. In some embodiments, various of thesefeatures, such as the gripping portion 214, are omitted and/or variousadditional features are added to the canister 220. Any of the disclosedcanisters may include or may omit a solidifier.

FIG. 2B illustrates a rear view of the pump assembly 230 and canister220 according to some embodiments. The pump assembly 230 comprises aspeaker port 232 for producing sound. The pump assembly 230 includes afilter access door 234 with a screw 235 for removing the access door234, accessing, and replacing one or more filters, such as antibacterialor odor filters. The pump assembly 230 comprises a gripping portion 236formed in the case of the pump assembly. The gripping portion 236 can beconfigured to allow the user to hold the pump assembly 230, such asduring removal of the canister 220. The pump assembly 230 includes oneor more covers 238 configured to as screw covers and/or feet orprotectors for placing the pump assembly 230 on a surface. The covers230 can be formed out of rubber, silicone, or any other suitablematerial. The pump assembly 230 comprises a power jack 239 for chargingand recharging an internal battery of the pump assembly. The power jack239 can be a direct current (DC) jack. In some embodiments, the pumpassembly can comprise a disposable power source, such as batteries, sothat no power jack is needed.

The canister 220 includes one or more feet 244 for placing the canisteron a surface. The feet 244 can be formed out of rubber, silicone, or anyother suitable material and can be angled at a suitable angle so thatthe canister 220 remains stable when placed on the surface. The canister220 comprises a tube mount relief 246 configured to allow one or moretubes to exit to the front of the device. The canister 220 includes astand or kickstand 248 for supporting the canister when it is placed ona surface. As explained below, the kickstand 248 can pivot between anopened and closed position. In closed position, the kickstand 248 can belatched to the canister 220. In some embodiments, the kickstand 248 canbe made out of opaque material, such as plastic. In other embodiments,the kickstand 248 can be made out of transparent material. The kickstand248 includes a gripping portion 242 formed in the kickstand. Thegripping portion 242 can be configured to allow the user to place thekickstand 248 in the closed position. The kickstand 248 comprises a hole249 to allow the user to place the kickstand in the open position. Thehole 249 can be sized to allow the user to extend the kickstand using afinger.

FIG. 2C illustrates a view of the pump assembly 230 separated from thecanister 220 according to some embodiments. The pump assembly 230includes a vacuum attachment, connector, or inlet 252 through which avacuum pump communicates negative pressure to the canister 220. The pumpassembly aspirates fluid, such as gas, from the wound via the inlet 252.The pump assembly 230 comprises a USB access door 256 configured toallow access to one or more USB ports. In some embodiments, the USBaccess door is omitted and USB ports are accessed through the door 234.The pump assembly 230 can include additional access doors configured toallow access to additional serial, parallel, and/or hybrid data transferinterfaces, such as SD, Compact Disc (CD), DVD, FireWire, Thunderbolt,PCI Express, and the like. In other embodiments, one or more of theseadditional ports are accessed through the door 234.

FIG. 3 illustrates an electrical component schematic 300 of a pumpassembly, such as the pump assembly 230, according to some embodiments.Electrical components can operate to accept user input, provide outputto the user, operate the pump assembly and the TNP system, providenetwork connectivity, and so on. Electrical components can be mounted onone or more printed circuit boards (PCBs). As is illustrated, the pumpassembly can include multiple processors.

The pump assembly can comprise a user interface processor or controller310 configured to operate one or more components for accepting userinput and providing output to the user, such as the display 206, buttons212, etc. Input to the pump assembly and output from the pump assemblycan controlled by an input/output (I/O) module 320. For example, the I/Omodule can receive data from one or more ports, such as serial,parallel, hybrid ports, and the like. The processor 310 also receivesdata from and provides data to one or more expansion modules 360, suchas one or more USB ports, SD ports, Compact Disc (CD) drives, DVDdrives, FireWire ports, Thunderbolt ports, PCI Express ports, and thelike. The processor 310, along with other controllers or processors,stores data in one or more memory modules 350, which can be internaland/or external to the processor 310. Any suitable type of memory can beused, including volatile and/or non-volatile memory, such as RAM, ROM,magnetic memory, solid-state memory, magnetoresistive random-accessmemory (MRAM), and the like.

In some embodiments, the processor 310 can be a general purposecontroller, such as a low-power processor. In other embodiments, theprocessor 310 can be an application specific processor. The processor310 can be configured as a “central” processor in the electronicarchitecture of the pump assembly, and the processor 310 can coordinatethe activity of other processors, such as a pump control processor 370,communications processor 330, and one or more additional processors 380(e.g., processor for controlling the display 206, processor forcontrolling the buttons 212, etc.). The processor 310 can run a suitableoperating system, such as a Linux, Windows CE, VxWorks, etc.

The pump control processor 370 can be configured to control theoperation of a negative pressure pump 390, The pump 390 can be asuitable pump, such as a diaphragm pump, peristaltic pump, rotary pump,rotary vane pump, scroll pump, screw pump, liquid ring pump, diaphragmpump operated by a piezoelectric transducer, voice coil pump, and thelike. The pump control processor 370 can measure pressure in a fluidflow path, using data received from one or more pressure sensors,calculate the rate of fluid flow, and control the pump. The pump controlprocessor 370 can control a pump motor so that a desired level ofnegative pressure is achieved in the wound cavity 110. The desired levelof negative pressure can be pressure set or selected by the user. Invarious embodiments, the pump control processor 370 controls the pump(e.g., pump motor) using pulse-width modulation (PWM). A control signalfor driving the pump can be a 0-100% duty cycle PWM signal. The pumpcontrol processor 370 can perform flow rate calculations and detectvarious conditions in a flow path. The pump control processor 370 cancommunicate information to the processor 310. The pump control processor370 can include internal memory and/or can utilize memory 350. The pumpcontrol processor 370 can be a low-power processor.

A communications processor 330 can be configured to provide wired and/orwireless connectivity. The communications processor 330 can utilize oneor more antennas 340 for sending and receiving data. The communicationsprocessor 330 can provide one or more of the following types ofconnections: Global Positioning System (GPS) technology, cellularconnectivity (e.g., 2G, 3G, LTE, 4G), WiFi connectivity, Internetconnectivity, and the like. Connectivity can be used for variousactivities, such as pump assembly location tracking, asset tracking,compliance monitoring, remote selection, uploading of logs, alarms, andother operational data, and adjustment of therapy settings, upgrading ofsoftware and/or firmware, and the like. The communications processor 330can provide dual GPS/cellular functionality. Cellular functionality can,for example, be 3G functionality. The pump assembly can include a SIMcard, and SIM-based positional information can be obtained.

The communications processor 330 can communicate information to theprocessor 310, The communications processor 330 can include internalmemory and/or can utilize memory 350. The communications processor 330can be a low-power processor.

In some embodiments, using the connectivity provided by thecommunications processor 330, the device can upload any of the datastored, maintained, and/or tracked by the pump assembly. The device canalso download various operational data, such as therapy selection andparameters, firmware and software patches and upgrades, and the like.

FIG. 4A illustrates exploded view of a pump assembly 400, such as thepump assembly 230, according to some embodiments. The illustrated viewcan correspond to the front portion of the pump assembly 400. Thecomponents of the pump assembly 400 can include: a front enclosure 401,a GPS antenna 402, a status light pipe 403, adhesives 404, a liquidcrystal display (LCD) 405, a chassis and LCD circuit board assembly 406,screws 407, a main circuit board assembly 408, screws 409, standoffs410, a communications circuit board assembly 411 (including acommunications antenna), a negative pressure source 412, a power entrycable 413, a universal serial bus (USB) cable assembly 414, a subscriberidentity module (SIM) card 415, a bottom enclosure 416, a canisterconnector 417, a canister connector O-ring 418, and a keypad 419. FIGS.4B-4F illustrate multiple views of the pump assembly 400 according tosome embodiments. The dimensions included in FIGS. 4B-4F are provided ininches.

Although FIGS. 4A-4F show particular components included as part of thepump assembly 400, some components may be removed or other componentsmay be added in other implementations.

FIG. 5A illustrates exploded view of a pump assembly 500, such as thepump assembly 230, according to some embodiments. The illustrated viewcan correspond to the back portion of the pump assembly 500. Theillustrated components of the pump assembly 500 can be configured tocouple to the components of the pump assembly 400 to form an integralpump assembly. The components of the pump assembly 500 can include: anaccess door 501 (which can be the same as access door 234), a filterenclosure gasket 502, a filter 503 (for example, antibacterial filter,odor filter, and the like), a mini USB port cover 504, a back enclosure505, a power entry light pipe 506, a power entry circuit board assembly507, a USB circuit board assembly 508, a tubing outlet 509, a clip 510,a battery bracket 511, a battery 512, a speaker assembly 513, a speakerfilter 514, a push nut 515, a screw 516 (which can be the same as thescrew 235), screws 517, screws 518, and foam tape 519. FIGS. 5B-5Eillustrate multiple views of the pump assembly 500 according to someembodiments. The dimensions included in FIGS. 5B-5E are provided ininches.

Although FIGS. 5A-5F show particular components included as part of thepump assembly 500, some components may be removed or other componentsmay be added in other implementations.

Device Electronics

The electronics of a pump assembly can be constructed and positioned toimprove the tolerance of the pump assembly to environmental conditions.The pump assembly desirably can operate electrically or mechanicallyproperly or safely in various non-controlled environments like homehealthcare, airborne, automobile, boats, train, metal detectors, activeimplantable device, and the like.

The pump assembly can be configured to withstand high levels of ESD andin multiples steps, such as contact: ±2 kV (or lower), ±4 kV, ±6 kV, ±8kV or higher and air: ±2 kV (or lower), ±4 kV, ±6 kV, ±8 kV±15 kV, ±30kV or higher. The pump assembly can additionally or alternatively beconfigured to have high levels of magnetic immunity, for example formagnetic field strengths of 100 A/m (or lower), 150 A/m, 200 A/m, 400A/m or higher, as well as high levels of RF immunity, for example for RFsignal strengths of 10 V/m (or lower), 20 V/m and higher. Additionallyor alternatively, the pump assembly can withstand high levels ofmechanical strain (for example, shock, vibration, drop, or the like) andhigh altitude environments (for example, airborne mechanical). In someembodiments, the pump assembly complies with one or more of IEC 61000family standards relating to electromagnetic compatibility forelectrical and electronic equipment or one or more other applicableindustry standards.

The pump assembly can, in some implementations, be defibrillation-proof(for instance, defibrillation-proof as an entire applied part), such asis defined under the IEC 60601-1 standard, another standard, or otherindustry-accepted criteria. The pump assembly can, for example, continuenormal operation when monophasic or biphasic defibrillation shock isapplied. The pump assembly may not change its performance or presentfalse alarms under such conditions. Such a defibrillation-proofconstruction can be desirable because the pump assembly can then survivean external defibrillation shock in case a patient using the pumpassembly goes into cardiac arrest. Moreover, the pump assembly can bedefibrillator-proof while retaining usability.

One or more of the features described herein can enable the pumpassembly to withstand high levels of ESD, have magnetic immunity or RFimmunity, withstand high levels of mechanical strain, withstand highaltitude environment, or be defibrillation-proof.

The pump assembly can include one or more PCBs that mechanically supportand electrically connect electronic components using conductive tracks,pads and other features etched from copper sheets laminated onto anon-conductive substrate. Components, such as capacitors, resistors, oractive devices, can be soldered on the PCBs or embedded in thesubstrate. PCBs can be single sided (one copper layer), double sided(two copper layers) or multi-layer (outer and inner layers). Conductorson different layers are connected with vias. Multi-layer PCBs allow formuch higher component density. In one implementation, the pump assemblycan include one or more PCBs with one or two layers. In yet anotherimplementation, the pump assembly can include one or more PCBs withthree or more layers, such as six layers. The one or more PCBs can eachinclude components, such as one or more controllers, configured toperform one or more device functions, such as operating a negativepressure source, controlling power distribution in the pump assembly,communicating with other electronic devices, or operating as a userinterface, among other functions.

The pump assembly can be constructed to electrically isolate certaininternal device components and provide electromagnetic interferenceshielding (EMI) shielding, ESD protection, and other forms of electricalisolation.

The pump assembly can include a PCB positioned so that there is a gapbetween the edges of the PCB and a housing, such as a plastic housing,of the pump assembly. Additionally or alternatively, the pump assemblycan include a PCB constructed so that components (such as one or moremicrocontrollers or memories) coupled to the PCB are more than athreshold distance (for example, around 0.5 mm, 1 mm, 2 mm, 3 mm, 4 mm,or 5 mm) from an edge of the PCB. This can protect the PCB and itscomponents from interference as a result of ESD applied to the housing.

The pump assembly can include a software input-output bus that isconfigured to be substantially noise immune, including with respect toanalog inputs. The pump assembly can include an EMI shield on top of oneor more components such as a microcontroller or memory.

The pump assembly can include one or more nylon screws rather than metalscrews to provide better ESD protection for the pump assembly. One ormore nylon screws can be positioned on the external surface of thehousing. A nylon screw can, for example, be used to access a filter ofthe pump assembly, such as screw 235 or screw 501.

The pump assembly can include one or more internal gaskets to providebetter ESD protection for the pump assembly. The pump assembly may alsoinclude no exposed metal or limit an amount of exposed metal by coveringmetal parts to prevent arcing. For instance, a plug for a charging cablecan be electrically isolated and ears for connecting a clamp for thepump assembly can be electrically isolated.

The pump assembly can include a capacitor electrically coupled to one ormore individual connectors (for example, a USB connector or an antennaconnector) and an ESD clamp (such as a circuit with one or more diodes).The pump assembly can include conformal coating, relatively short cableassemblies, relatively short layout traces, or encapsulate specificlayout traces between planes. The pump assembly can also include planesand traces from an edge of a PCB or grounded metal shielding.

The pump assembly can include no gap or change of material which couldbe an electrical channel to a PCB at energy and current levelexperienced under defibrillation conditions. One or more light-emittingdiodes (LEDs) of the pump assembly can be behind a solid, unbroken, andtranslucent front cover rather than having a light-pipe, lens, or othermeans to transmit the light.

In view of the device structures described herein, the pump assembly maynot protect against overvacuum or another erroneous operational mode inthe event of an electrical short because the pump assembly may havealternative capabilities to handle the electrical short.

The pump assembly can include electrical isolation to isolate water,urine, or blood ingress from short-circuiting the pump assembly.

The pump assembly can, in some instances, use a tuned receiver forcommunication and perform shorting and capacitor protection of thereceiver. Interference outside of a frequency of interest can be shortedto ground. The pump assembly may still have some vulnerability at thefrequency of interest, but the vulnerability may notably be acceptableif the frequency is different from the spectrum of interference.

Features of the pump assembly to protect against electrical shock, ESD,and the like can desirably protect a pump assembly from damage ormalfunction or protect a patient or clinician from being shocked.

FIG. 6A illustrates a front of a main PCB 600 of a pump assembly, suchas the pump assembly 230, according to some embodiments. The main PCB600 can, for example, be an embodiment of the main circuit boardassembly 408. The main PCB 600 can include a digital signal processor610 for controlling a source of negative pressure, an electromagneticcompatibility shield 620 for an LED backlight (for example, to protectagainst high voltages like 12 V rather than 3 V), a shielded batterycharger 630, a shielded memory and main microcontroller 640, a batteryconnector 650, and a shielded regulator 660 for digital circuitry. FIG.6B illustrates a back of the main PCB 600.

FIGS. 7A and 7B illustrate a front and back of a wireless communicationPCB assembly 700 of a pump assembly, such as the pump assembly 230,according to some embodiments. The wireless communication PCB 700assembly can, for example, be an embodiment of the communicationscircuit board assembly 411. The wireless communication PCB assembly 700can include an antenna board 710 and a PCB 705 with a shielded wirelesscommunication controller 720 and a shielded voltage regulator 730. Theantenna board 710 can be wireless mobile communications antenna, such asingle-, dual-, tri-, quad-, or the like band antenna for communicatingvia 2G, 3G, LTE, 4G, or the like and be mounted to the communicationsPCB 705 with mounting brackets 712. The wireless communication PCBassembly 700 can be electrically coupled via a path 740 to a GPS antenna750, which can be an embodiment of the GPS antenna 402.

FIG. 7C illustrates a side of the wireless communication PCB assembly700 with the path 740 and the GPS antenna 750 removed. As can be seen,the antenna board 710 can be mounted to extend along a line A at anangle ∠θ° relative to a line B that extends perpendicular to a line Cthat extends parallel to a direction in which the PCB 705 extends. Theangle ∠θ° can be non-zero in some implementations, but zero in otherimplementations. For instance, the angle ∠θ° can be between a minimum of∠1°, ∠5°, ∠10°, ∠15°, ∠20°, ∠25°, ∠30°, or ∠35° and a maximum of ∠45°,∠50°, ∠55°, ∠60°, ∠65°, ∠70°, ∠75°, ∠80°, ∠85°, or ∠89°. The angle ∠θ°can, for example, be ∠15°, ∠20°, ∠25°, ∠30°, ∠35°, ∠40°, or ∠45° orapproximately so. In other implementations, the antenna board 710 can bemounted to angle in the opposite direction and yet face downward suchthat the angle ∠θ° can instead be between a minimum of ∠−45°, ∠−50°,∠−55°, ∠−60°, ∠−65°, ∠−70°, ∠−75°, ∠−80°, ∠−85°, or ∠−89° and a maximumof ∠−1°, ∠−5°, ∠−10°, ∠−15°, ∠−20°, ∠−25°, ∠−30°, or ∠−35° and, forexample, have a value of ∠−15°, ∠−20°, ∠−25°, ∠−30°, ∠−35°, ∠−40°, or∠−45° or approximately so. The angle ∠θ° may be selected, in someimplementations, so that the antenna board 710 does not face directlydownwards at the orientations at which the pump assembly may be used(for example, when the pump assembly may be positioned on a canister ona flat surface, position at an angle resting on a kickstand of the pumpassembly or canister, or coupled to a pole using a clamp).

As is illustrated in FIGS. 7A-7C, the antenna board 710 can bemechanically coupled to the PCB 705. The antenna board 710 can, forexample, be mounted to the PCB 705 (or at another suitable orientation)using one or more fasteners (for instance, two fasteners) and one ormore brackets (for instance, two brackets), as illustrated in FIGS.7A-70. The antenna board 710 can transmit electromagnetic signalsdownward, such as toward the ground (of the earth) or a surface on whichthe pump assembly is positioned. The antenna board 710 can therebycommunicate by reflecting signal electromagnetic signals off of one ormore surfaces below the antenna board 710.

FIG. 7D illustrates a perspective view of components of the wirelesscommunication PCB assembly 700 according to some embodiments. Theantenna board 710 can be mounted to the communications PCB 705 with themounting brackets 712 secured to the PCB 705 with pins, screws, orrivets 716. Although two brackets 712 are illustrated, in someembodiments, one bracket or more than two brackets can be used. Thebrackets 712 can be secured to the antenna board 710 using tape 714alone or in combination with pegs or pins 724 being aligned with (andwhen assembled fitting through) the holes 770, 772, 780, and 782 of theantenna board 710. Pegs or protrusions 762 and 792 of the PCB 705 alsocan be aligned with (and when assembled fit through) the holes 760 and790 of the antenna board 710. The antenna can be oriented at any desiredangle to the PCB 705. In some implementations, desired orientation canbe achieved by rotating or pivoting the brackets 712 about the rivets716.

FIG. 8A illustrates a top layer 800 of a wireless communication PCBassembly, such as the wireless communication assembly PCB 700, accordingto some embodiments. The top layer 800 can, for instance, be a top filmlayer. The top layer 800 includes conductive portions (shown as darkenedor shaded areas) and nonconductive portions or voids (shown asundarkened or white areas), The top layer 800 moreover includes multiplefeatures including at least ground (GND) plane, mounting pads 802A-D formounting the wireless communication PCB assembly, a connector orconnection 804 between the antenna board 710 and the PCB 705. Theconnection 804 can provide a transmit signal feed from a controller (forexample, the communication controller 720) and the antenna board 710when antenna is transmitting (or is in a transmit mode). The connection804 can provide a receive signal feed from the antenna board 710 to thecontroller when the antenna is receiving (or is in a receive mode). Theconnection 804 can, in some implementations, be the sole connectionpoint for transmitting and receiving signals via the antenna board 710.Antenna trace 806, which includes first and second portions 860 and 862,is connected to the ground plane 810 at or near location 870. The trace806 includes conductive material, such as copper, and can serve as aground plane for the antenna board 710. Connection between the trace 806and the ground plane 810 of the PCB 705 can be accomplished with a shuntor another suitable component.

In certain implementations, the top side of the antenna board 710 can beplaced facing down toward the ground and facing away from the PCB 705when the antenna board is mounted to the PCB 705. Connection 760 can belocated on the bottom side of the antenna board, which faces the PCB 705when the antenna board is mounted to the PCB 705. In this configuration,connection 804 on the PCB 705 faces connection 760 on the antenna board710. As is explained herein, protrusion 762 of the PCB 705 can be placedin the hole 760 of the antenna board 710. Electrical connection betweenconnection 804 and 760 can be made, for example, using soldering oranother suitable mechanism.

FIG. 8B illustrates a bottom layer 820 of the wireless communication PCBassembly of FIG. 8A according to some embodiments. The bottom layer 820can, for instance, be a bottom film layer. The bottom layer 820 includesconductive portions (shown as darkened or shaded areas) andnonconductive portions or voids (shown as undarkened or white areas).The bottom layer 820 includes multiple features including at least aground (GND) plane and an antenna connector or connection 822.Connection 822 can be used as a mechanical connection for securing theantenna board 710. For instance, when the antenna board is positionedtop side facing downward as explained herein, because connection 822 ispositioned on the opposite side of the board with respect to connection804, more reliable or secure mechanical connection can be made bysoldering (or using another suitable attachment) a portion of the topsurface of the antenna board (for example, area on the top sideincluding and/or surrounding the whole 760) to the connection 822. Insuch instances, connection 822 does not provide any electricalconnectivity, but is used solely for mechanical support. As explainedherein, protrusion 762 of the PCB 705 can be placed in the hole 760 ofthe antenna board 710 so that connection 822 is located proximal the topsurface of the antenna board Soldering the antenna board connection 760on the opposite, bottom side of the antenna board 710 to the connection804 can provide electrical connection and, optionally, additionalmechanical support. In some embodiments, the locations of the antennaconnection 822 and the connection 804 can be switched (for example, theantenna connection 822 can be placed on the top layer 800) particularlywhen the antenna board is positioned top side facing upward away fromthe ground.

FIG. 8C illustrates an internal ground plane 840 of the wirelesscommunication PCB assembly of FIG. 8A according to some embodiments. Theinternal ground plane 840 includes conductive portions (shown asdarkened or shaded areas) and nonconductive portions or voids (shown asundarkened or white areas). The internal ground plane 840 includes aground extending around a perimeter of the PCB, as well as a ground area842 proximate the antenna, which can help with for reducing noise (suchas EMI) associated with the antenna. The ground area 842 can have athickness that is greater (for example, more than 2, 3, 4, 5, 6, 7, or 8times the thickness) than a thickness of the other parts of the groundextending around a perimeter of the PCB. The internal ground plane 840further includes grounding at the locations of the mounting pads so thatthe mounting holes for the wireless communication PCB assembly may begrounded.

FIG. 8D illustrates an internal power plane 860 of the wirelesscommunication PCB assembly of FIG. 8A according to some embodiments. Theinternal power plane 860 includes conductive portions (shown as darkenedor shaded areas) and nonconductive portions or voids (shown asundarkened or white areas). The internal power plane 860 includesmultiple features including at least ground, mounting pads, and voltagesupply areas +V1, +V2, +V3, +V4.

With the structures depicted in FIGS. 8A-8D, the wireless communicationPCB assembly can experience one or more benefits in someimplementations. The wireless communication PCB assembly can, forexample, be protected from interference (such as EMI) where noise in thetransmission band may be fed back to the antenna. In addition, thewireless communication PCB assembly may not include long traces on thebottom some layer or top film layer, which may act as transmitters, andsignal traces instead may be moved inward where they are shielded fromradiating noise by ground. In some embodiments, one or more capacitorsare utilized to provide noise immunity or suppression. For example, theone or more capacitors can be used to construct a low-pass filter (suchas a RC filter, LC filter, etc.) that suppresses high-frequencyinterference. The one or more capacitors can be used to protect one ormore input signals.

Device Antenna

A pump assembly, such as the pump assembly 230, can communicate using anantenna, such as the antenna board 710 of FIG. 7A, with one or moreother electronic devices. The antenna can be positioned near a base ofthe pump assembly or near a canister coupled to the pump assembly. Theposition of the antenna proximate the canister can enable the canisterto function as an electromagnetic shield or insulator from EMI, ESD, orelectric shock (such as from a defibrillator) and protect the antennafrom ESD and internal noise from other electronic components of the pumpassembly. Such positioning may also desirably afford additional spacefor increasing a size of the antenna to improve a signal strengthobtained with the antenna, as well as to enable the canister to functionas a spacer to space the antenna off of the ground or other surface onwhich the pump assembly is positioned.

The antenna can be oriented to face downward (for example, toward theground, floor, desk, bed, or other surface on which the pump assembly ispositioned) rather than upward (for example, toward a ceiling or sky) orsideward (for example, toward side wall of a room) when the pumpassembly is oriented for delivery of negative pressure therapy. Thisorientation can allow the antenna to reflect a communication signal (forexample, a strongest signal or most of the energy of the signal receivedor output by the antenna) off the ground or another surface on which thepump assembly is positioned.

In some implementations, the antenna can be positioned as far aspossible from a ground plane or another plane of the PCB 705 to which itis connected. The antenna however can still be positioned inside thepump assembly housing to prevent the antenna from picking up anyundesirable PCB noise or being shielded by the PCB or other boardcomponents.

FIG. 9 illustrates a pump assembly 900, such as the pump assembly 230,communicating using an antenna according to some embodiments. Theantenna can, for example, be an embodiment of the antenna board 710. Asillustrated, the antenna of the pump assembly 900 can be positioned sothat the antenna may not be planar with a bulk head of the pump assembly900. This may advantageously enable the antenna to angle forwards orbackwards (for instance, toward a GUI like a display screen) when thepump assembly 900 may be sat on a flat base of a canister. Theelectromagnetic radiation from the antenna may thus not have a tendencyto bounce back toward the pump assembly 900 but may instead bounce awayfrom the pump assembly 900.

Device User Interface

A pump assembly can include a user interface that improves the toleranceof the pump assembly to environmental conditions. The pump assembly caninclude one or more buttons, such as buttons 212 a, 212 b, and 212 c, orother components (for example, a power supply or battery or shielding orwaterproofing) constructed to handle pressure variations at differentaltitudes, including relatively high altitudes. The button or othercomponents can be or include a membrane or formed of molded rubber. Thebuttons or other components can include a vent, valve, or be breathableto allow the membrane to accept and release air to prevent the buttonsfrom changing size at various altitude (such as, growing in size andpotentially exploding at higher altitudes, such as at a flying altitudeof in a helicopter, airplane, etc.). The flying altitude can be 1500feet or higher, such as 2000 feet, 3000 feet, 8000 feet, 20000, 30000feet. Moreover, any elastomeric key, membrane switch, or any userinterface of the pump assembly that includes an enclosure filled withgas can be similarly vented. In the absence of a pressure relief, thebuttons or other components may become so full of air that thecomponents are unable to be usable until the pump assembly is operatedunder more typical pressure conditions. The vents or values in moreovercan include a filter to prevent passage of liquid, such as a filter thatis hydrophobic. In some implementations, components compliant for use inaircraft's can be used as part of the pump assembly to ensureappropriate pressure tolerance.

The pump assembly can include one or more switches that are able towithstand extreme temperature conditions. A pump assembly canadditionally or alternatively include one or more hardware buttons,relays, rotary switches, or touch controls.

The pump assembly can include a reinforced liquid crystal display (LCD)screen with a non-conductive gasket in the LCD. The LCD screen can haveEMC/ESD shield protection via a high hardness glass, which can alsoprovide resistance against force (for example, to additional increasepatient safety). Additionally or alternatively, a LCD screen can includea vent to allow pressure normalization and to prevent cracking if theLCD is exposed to different pressure environments.

Other Variations

In one embodiment, an apparatus for applying negative pressure to awound is disclosed. The apparatus can include a housing, a negativepressure source, a canister, a user interface, and one or morecontrollers. The negative pressure source can provide negative pressurevia a fluid flow path to a wound dressing. The canister can bepositioned in the fluid flow path and collect fluid removed from thewound dressing. The one or more controllers can: activate and deactivatethe negative pressure source, and output an alarm indicating presence ofa leak in the fluid flow path or that pressure in the fluid flow pathfailed to satisfy a desired pressure threshold. The one or morecontrollers can continue to activate and deactivate the negativepressure source subsequent to the wound dressing being exposed to adefibrillation shock while the negative pressure source is maintainingnegative pressure below a negative pressure threshold, or the one ormore controllers may not erroneously output the alarm as a result of thewound dressing being exposed to a defibrillation shock while thenegative pressure source is maintaining negative pressure below thenegative pressure threshold. The apparatus can be performing negativepressure therapy when the magnitude is maintained below the negativepressure threshold. The apparatus, moreover can function correctly andsafely after a monophasic or biphasic electrical pulse of 5 KV/250 J (oranother suitable intensity) from an external defibrillator.

Any value of a threshold, limit, duration, etc. provided herein is notintended to be absolute and, thereby, can be approximate. In addition,any threshold, limit, duration, etc. provided herein can be fixed orvaried either automatically or by a user. Furthermore, as is used hereinrelative terminology such as exceeds, greater than, less than, etc. inrelation to a reference value is intended to also encompass being equalto the reference value. For example, exceeding a reference value that ispositive can encompass being equal to or greater than the referencevalue. In addition, as is used herein relative terminology such asexceeds, greater than, less than, etc. in relation to a reference valueis intended to also encompass an inverse of the disclosed relationship,such as below, less than, greater than, etc. in relations to thereference value. Moreover, although blocks of the various processes maybe described in terms of determining whether a value meets or does notmeet a particular threshold, the blocks can be similarly understood, forexample, in terms of a value (i) being below or above a threshold or(ii) satisfying or not satisfying a threshold.

Features, materials, characteristics, or groups described in conjunctionwith a particular aspect, embodiment, or example are to be understood tobe applicable to any other aspect, embodiment or example describedherein unless incompatible therewith. All of the features disclosed inthis specification (including any accompanying claims, abstract anddrawings), or all of the steps of any method or process so disclosed,may be combined in any combination, except combinations where at leastsome of such features or steps are mutually exclusive. The protection isnot restricted to the details of any foregoing embodiments. Theprotection extends to any novel one, or any novel combination, of thefeatures disclosed in this specification (including any accompanyingclaims, abstract and drawings), or to any novel one, or any novelcombination, of the steps of any method or process so disclosed.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of protection. Indeed, the novel methods and systems describedherein may be embodied in a variety of other forms. Furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made. Those skilled in the art willappreciate that in some embodiments, the actual steps taken in theprocesses illustrated or disclosed may differ from those shown in thefigures. Depending on the embodiment, certain of the steps describedabove may be removed, others may be added. For example, the actual stepsor order of steps taken in the disclosed processes may differ from thoseshown in the figure. Depending on the embodiment, certain of the stepsdescribed above may be removed, others may be added. For instance, thevarious components illustrated in the figures may be implemented assoftware or firmware on a processor, controller, ASIC, FPGA, ordedicated hardware. Hardware components, such as processors, ASICs,FPGAs, and the like, can include logic circuitry. Furthermore, thefeatures and attributes of the specific embodiments disclosed above maybe combined in different ways to form additional embodiments, all ofwhich fall within the scope of the present disclosure.

User interface screens illustrated and described herein can includeadditional or alternative components. These components can includemenus, lists, buttons, text boxes, labels, radio buttons, scroll bars,sliders, checkboxes, combo boxes, status bars, dialog boxes, windows,and the like. User interface screens can include additional oralternative information. Components can be arranged, grouped, displayedin any suitable order.

Although the present disclosure includes certain embodiments, examplesand applications, it will be understood by those skilled in the art thatthe present disclosure extends beyond the specifically disclosedembodiments to other alternative embodiments or uses and obviousmodifications and equivalents thereof, including embodiments which donot provide all of the features and advantages set forth herein.Accordingly, the scope of the present disclosure is not intended to belimited by the specific disclosures of preferred embodiments herein, andmay be defined by claims as presented herein or as presented in thefuture.

Conditional language, such as “can,” “could,” “might,” or “may,” unlessspecifically stated otherwise, or otherwise understood within thecontext as used, is generally intended to convey that certainembodiments include, while other embodiments do not include, certainfeatures, elements, or steps. Thus, such conditional language is notgenerally intended to imply that features, elements, or steps are in anyway required for one or more embodiments or that one or more embodimentsnecessarily include logic for deciding, with or without user input orprompting, whether these features, elements, or steps are included orare to be performed in any particular embodiment. The terms“comprising,” “including,” “having,” and the like are synonymous and areused inclusively, in an open-ended fashion, and do not excludeadditional elements, features, acts, operations, and so forth. Also, theterm “or” is used in its inclusive sense (and not in its exclusivesense) so that when used, for example, to connect a list of elements,the term “or” means one, some, or all of the elements in the list.Further, the term “each,” as used herein, in addition to having itsordinary meaning, can mean any subset of a set of elements to which theterm “each” is applied.

Conjunctive language such as the phrase “at least one of X, Y, and Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to convey that an item, term, etc. may beeither X, Y, or Z, Thus, such conjunctive language is not generallyintended to imply that certain embodiments require the presence of atleast one of X, at least one of Y, and at least one of Z.

Language of degree used herein, such as the terms “approximately,”“about,” “generally,” and “substantially” as used herein represent avalue, amount, or characteristic close to the stated value, amount, orcharacteristic that still performs a desired function or achieves adesired result. For example, the terms “approximately”, “about”,“generally,” and “substantially” may refer to an amount that is withinless than 10% of, within less than 5% of, within less than 1% of, withinless than 0.1% of, and within less than 0.01% of the stated amount. Asanother example, in certain embodiments, the terms “generally parallel”and “substantially parallel” refer to a value, amount, or characteristicthat departs from exactly parallel by less than or equal to 15 degrees,10 degrees, 5 degrees, 3 degrees, 1 degree, or 0.1 degree.

The scope of the present disclosure is not intended to be limited by thespecific disclosures of preferred embodiments in this section orelsewhere in this specification, and may be defined by claims aspresented in this section or elsewhere in this specification or aspresented in the future. The language of the claims is to be interpretedbroadly based on the language employed in the claims and not limited tothe examples described in the present specification or during theprosecution of the application, which examples are to be construed asnon-exclusive.

What is claimed:
 1. An apparatus for applying negative pressure to awound, the apparatus comprising: a housing; a negative pressure sourcesupported by the housing and configured to provide negative pressure viaa fluid flow path to a wound dressing; a first circuit board supportedby the housing and comprising an edge; a second circuit board configuredto radiate and detect electromagnetic waves from a side of the secondcircuit board, the second circuit board being mechanically mounted tothe first circuit board and positioned proximate to and extending alongthe edge of the first circuit board, the second circuit board beingelectrically connected to the first circuit board and configured towirelessly communicate with an electronic device via the electromagneticwaves, the side of the second circuit board being oriented in thehousing to face toward a side of the housing that is configured tosupport a canister so that the electromagnetic waves radiated from theside of the second circuit board are transmitted toward the side of thehousing that is configured to support the canister, the canister beingconfigured to be positioned in the fluid flow path and collect fluidremoved from the wound dressing; and one or more controllers configuredto: activate and deactivate the negative pressure source, and transmitfirst data to the electronic device using the electromagnetic wavesradiated from the side of the second circuit board or receive seconddata from the electronic device using the electromagnetic waves detectedfrom the side of the second circuit board.
 2. The apparatus of claim 1,wherein the one or more controllers comprises a communicationscontroller supported by the first circuit board.
 3. The apparatus ofclaim 1, further comprising the canister, the canister being configuredto provide electromagnetic shielding to the side of the second circuitboard.
 4. The apparatus of claim 1, wherein the one or more controllerscomprises a communications controller supported by the first circuitboard, and the second circuit board is connected to the communicationscontroller via a single antenna connector.
 5. The apparatus of claim 4,wherein the first circuit board comprises the single antenna connectorand a ground connector for the second circuit board, and the groundconnector for the second circuit board is positioned on an opposite sideof the first circuit board from the single antenna connector.
 6. Theapparatus of claim 4, further comprising a bracket that mechanicallymounts the second circuit board to the first circuit board.
 7. Theapparatus of claim 1, wherein the housing comprises an access doorpositioned on an exterior of the housing and a nylon screw configured tocontrol removal of the access door to permit access to an interior ofthe housing.
 8. The apparatus of claim 1, wherein the second circuitboard is configured to communicate via a cellular network using theelectromagnetic waves.
 9. The apparatus of claim 1, wherein the one ormore controllers is configured to transmit the first data to theelectronic device using the electromagnetic waves radiated from the sideof the second circuit board and receive the second data from theelectronic device using the electromagnetic waves detected from the sideof the second circuit board.
 10. The apparatus of claim 9, wherein thefirst data comprises operational data for the negative pressure source.11. The apparatus of claim 10, wherein the second data comprises asoftware update for the one or more controllers.
 12. The apparatus ofclaim 1, wherein the negative pressure source, the first circuit board,the second circuit board, and the one or more controllers are positionedin the housing.
 13. The apparatus of claim 1, wherein the second circuitboard is mechanically mounted at an angle relative to the first circuitboard so that a first plane defined by the second circuit board is notparallel to a second plane defined by the first circuit board.
 14. Theapparatus of claim 1, wherein the first circuit board comprises asurface on which at least one of the one or more controllers is mounted,and the second circuit board is mechanically mounted to the firstcircuit board so that the surface of the first circuit board faces afirst direction different from a second direction in which the surfaceof the second circuit board faces.
 15. The apparatus of claim 1, furthercomprising an antenna separate from the second circuit board, theantenna being electrically connected to the first circuit board by awire.
 16. The apparatus of claim 15, wherein the second circuit board isconfigured to communicate via a cellular network using theelectromagnetic waves, and the antenna comprises a Global PositioningSystem (GPS) antenna.
 17. The apparatus of claim 1, wherein a portion ofthe first circuit board protrudes through a first hole in the secondcircuit board.
 18. The apparatus of claim 17, further comprising: abracket connecting the first circuit board to the second circuit board;and a fastener connecting the first circuit board to the bracket,wherein a portion of the bracket protrudes through a second hole in thesecond circuit board different from the first hole.